Photoelectric conversion device

ABSTRACT

A photoelectric conversion device with improved electric characteristics is provided. The photoelectric conversion device has a structure in which a window layer is formed by a stack of a first silicon semiconductor layer and a second silicon semiconductor layer, and the second silicon semiconductor layer has high carrier concentration than the first silicon semiconductor layer and has an opening. Light irradiation is performed on the first silicon semiconductor layer through the opening without passing through the second silicon semiconductor layer; thus, light absorption loss in the window layer can be reduced.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to photoelectric conversion devices.

2. Description of the Related Art

In recent years, photoelectric conversion devices that do not producecarbon dioxide during power generation have attracted attention as ameasure against global warming. As typical examples thereof solar cellshave been known which use crystalline silicon substrates such as singlecrystalline and polycrystalline silicon substrates.

In solar cells using a crystalline silicon substrate, a structure havinga so-called homo junction is widely used. In such a structure, a layerhaving a conductivity type opposite to that of the crystalline siliconsubstrate is formed on one surface side of the crystalline siliconsubstrate by diffusion of impurities.

Alternatively, a structure with a heterojunction is known in whichamorphous silicon having different optical band gap and conductivitytype from those of a crystalline silicon substrate is formed on onesurface side of the crystalline silicon substrate (see Patent Documents1 and 2).

REFERENCE Patent Documents

[Patent Document 1] Japanese Published Patent Application No. H04-130671[Patent Document 2] Japanese Published Patent Application No. H10-135497

SUMMARY OF THE INVENTION

In a solar cell having the heterojunction, a p-n junction is formed inwhich an i-type amorphous semiconductor layer is provided between asingle crystal semiconductor substrate having one conductivity type andan amorphous semiconductor layer having a conductivity type opposite tothat of the single crystal silicon substrate.

The provision of the i-type amorphous semiconductor layer in a p-njunction region has effects of terminating surface defects of the singlecrystal semiconductor substrate and forming a steep junction, whichcontributes to reduction in carrier recombination at a hetero interface.

On the other hand, the amorphous semiconductor layer having aconductivity type opposite to that of the single crystal siliconsubstrate and provided as a window layer and the i-type amorphoussemiconductor layer have been a factor in light absorption loss.

Although photo-carriers are generated also in the window layer, minoritycarriers are likely to be recombined in the window layer; thus,photo-carriers taken out as current are almost generated on a backelectrode side in the crystalline silicon substrate, which is theopposite side of the p-n junction. That is, light absorbed in the windowlayer is not substantially utilized

Further, small electrical conductivity of the i-type amorphoussemiconductor layer, which owes to its amorphous structure, has been afactor in resistance loss.

Thus, an object of one embodiment of the present invention is to providea photoelectric conversion device with low light absorption loss.Further, another object of one embodiment of the present invention is toprovide a photoelectric conversion device with small resistance loss.

One embodiment of the present invention disclosed in this specificationis a photoelectric conversion device in which a window layer is formedby a stack of a first silicon semiconductor layer and a second siliconsemiconductor layer. The second silicon semiconductor layer has highercarrier concentration than the first silicon semiconductor layer and hasan opening.

One embodiment of the present invention disclosed in this specificationis a photoelectric conversion device including a crystalline siliconsubstrate; a first silicon semiconductor layer formed on one surface ofthe crystalline silicon substrate; a second silicon semiconductor layerhaving an opening and formed on the first silicon semiconductor layer; alight-transmitting conductive film formed on the first siliconsemiconductor layer and the second silicon semiconductor layer; a firstelectrode formed on the light-transmitting conductive film andoverlapping with the second silicon semiconductor layer; a third siliconsemiconductor layer formed on the other surface of the crystallinesilicon substrate; a fourth silicon semiconductor layer formed on thethird silicon semiconductor layer; and a second electrode formed on thefourth silicon semiconductor layer.

It is to be noted that the ordinal numbers such as “first” and “second”in this specification, etc. are assigned in order to avoid confusionamong components, but not intended to limit the number or order of thecomponents.

In the photoelectric conversion device, an opening may be formed in thefourth silicon semiconductor layer and a light-transmitting conductivefilm may be formed on third silicon semiconductor layer and the fourthsilicon semiconductor layer.

In the photoelectric conversion device, the first electrode can beformed to overlap with a part of the second silicon semiconductor layer.

Another embodiment of the present invention disclosed in thisspecification is a photoelectric conversion device including acrystalline silicon substrate; a first silicon semiconductor layerformed on one surface of the crystalline silicon substrate; a firstlight-transmitting conductive film having an opening and formed on thefirst silicon semiconductor layer; a second silicon semiconductor layerformed in the opening and being in contact with the first siliconsemiconductor layer; a first electrode formed on the second siliconsemiconductor layer; a second light-transmitting conductive filmcovering the first light-transmitting conductive film, the secondsilicon semiconductor layer, and the first electrode; a third siliconsemiconductor layer formed on the other surface of the crystallinesilicon substrate; a fourth silicon semiconductor layer formed on thethird silicon semiconductor layer; and a second electrode formed on thefourth silicon semiconductor layer.

Another embodiment of the present invention disclosed in thisspecification is a photoelectric conversion device including acrystalline silicon substrate; a first silicon semiconductor layerformed on one surface of the crystalline silicon substrate; a secondsilicon semiconductor layer having an opening and formed on the firstsilicon semiconductor layer; a first electrode overlapping with thesecond silicon semiconductor layer; a light-transmitting thin filmcovering the first silicon semiconductor layer, the second siliconsemiconductor layer, and the first electrode; a third siliconsemiconductor layer formed on the other surface of the crystallinesilicon substrate; a fourth silicon semiconductor layer formed on thethird silicon semiconductor layer; and a second electrode formed on thefourth silicon semiconductor layer.

The crystalline silicon substrate preferably has n-type conductivity.The first silicon semiconductor layer and the second siliconsemiconductor layer each preferably have p-type conductivity. The thirdsilicon semiconductor layer preferably has i-type conductivity or n-typeconductivity. The fourth silicon semiconductor layer preferably hasn-type conductivity.

It is preferable that the second silicon semiconductor layer have highercarrier concentration than the first silicon semiconductor layer and thefourth silicon semiconductor layer have higher carrier concentrationthan the third silicon semiconductor layer.

According to one embodiment of the present invention, light absorptionloss in the window layer of the photoelectric conversion device can bereduced. Further, resistance loss of the photoelectric conversion devicecan be reduced. Thus, the photoelectric conversion device with highconversion efficiency can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are a plan view and a cross-sectional view of aphotoelectric conversion device according to one embodiment of thepresent invention.

FIGS. 2 A and 2B are a plan view and a cross-sectional view of aphotoelectric conversion device according to one embodiment of thepresent invention.

FIGS. 3A and 3B are cross-sectional views of a photoelectric conversiondevice according to one embodiment of the present invention.

FIGS. 4A and 4B are cross-sectional views of a photoelectric conversiondevice according to one embodiment of the present invention.

FIG. 5 is a plan view of a photoelectric conversion device according toone embodiment of the present invention.

FIG. 6 is a plan view of a photoelectric conversion device according toone embodiment of the present invention.

FIGS. 7A to 7C are cross-sectional views illustrating a method formanufacturing a photoelectric conversion device according to oneembodiment of the present invention.

FIGS. 8A to 8C are cross-sectional views illustrating a method formanufacturing a photoelectric conversion device according to oneembodiment of the present invention.

FIG. 9 is a cross-sectional view of a photoelectric conversion deviceaccording to one embodiment of the present invention.

FIGS. 10A and 10B are cross-sectional views of a photoelectricconversion device according to one embodiment of the present invention.

FIGS. 11A to 11C are cross-sectional views illustrating a method formanufacturing a photoelectric conversion device according to oneembodiment of the present invention.

FIGS. 12A to 12C are cross-sectional views illustrating a method formanufacturing a photoelectric conversion device according to oneembodiment of the present invention.

FIG. 13 is a cross-sectional view of a photoelectric conversion deviceaccording to one embodiment of the present invention.

FIGS. 14A and 14B are cross-sectional views of a photoelectricconversion device according to one embodiment of the present invention.

FIGS. 15A to 15C are cross-sectional views illustrating a method formanufacturing a photoelectric conversion device according to oneembodiment of the present invention.

FIGS. 16A to 16C are cross-sectional views illustrating a method formanufacturing a photoelectric conversion device according to oneembodiment of the present invention.

DETAILED DESCRIPTION OF INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. However, the presentinvention is not limited to the description below, and it is easilyunderstood by those skilled in the art that modes and details disclosedherein can be modified in various ways without departing from the spiritand the scope of the present invention. Therefore, the present inventionis not construed as being limited to description of the embodiments. Inthe drawings for explaining the embodiments, the same portions orportions having similar functions are denoted by the same referencenumerals, and description of such portions is not repeated in somecases.

Embodiment 1

In this embodiment, a photoelectric conversion device of one embodimentof the present invention and a method for manufacturing thereof will bedescribed.

FIG. 1A is a plan view of a photoelectric conversion device of oneembodiment of the present invention and FIG. 1B is a cross-sectionalview taken along line A1-A2 of FIG. 1A. The photoelectric conversiondevice includes a crystalline silicon substrate 100; a first siliconsemiconductor layer 110, a second silicon semiconductor layer 120, alight-transmitting conductive film 150, and a first electrode 170 whichare formed on one surface of the crystalline silicon substrate 100; anda third silicon semiconductor layer 130, a fourth silicon semiconductorlayer 140, and a second electrode 190 which are formed on the othersurface of the crystalline silicon substrate 100. Note that the firstelectrode 170 is a grid electrode, and a surface on the first electrode170 side serves as a light-receiving surface.

Note that the shape of the first electrode 170 illustrated in the planview of FIG. 1A is an example and not limited thereto. For example, thewidth of each of electrodes in the vertical direction and horizontaldirection, the number of electrodes, and an interval between electrodescan be determined as appropriate by a practitioner so that one of theelectrodes in the vertical direction and the electrodes in thehorizontal direction serve as bus bar electrodes and the other serve asfinger electrodes. Further, as illustrated in FIG. 5, a light-receivingregion may be enlarged by reducing the area of a region where the firstelectrode 170 overlaps with the second silicon semiconductor layer 120.

Further, FIG. 1B illustrates an example in which a front surface and aback surface of the crystalline silicon substrate 100 are processed tohave unevenness. Incident light is reflected in a multiple manner on thesurface processed to have unevenness, and travels obliquely in aphotoelectric conversion region; thus, the optical path length can beincreased. In addition, a so-called light trapping effect in whichreflected light by the back surface is totally reflected at the surfacecan occur. Note that in order to prevent broadening and disconnection ofthe first electrode 170, a part of the crystalline silicon substrate 100in contact with the first silicon semiconductor layer 110 may be flatwithout being processed to have unevenness.

A single crystal silicon substrate or a polycrystalline siliconsubstrate, which has one conductivity type, can be used for thecrystalline silicon substrate 100. In this embodiment, a single crystalsilicon substrate having n-type conductivity is used for the crystallinesilicon substrate 100.

In the above structure, p-type silicon semiconductor layers are used forthe first silicon semiconductor layer 110 and the second siliconsemiconductor layer 120 having an opening, which are formed on the onesurface of the crystalline silicon substrate 100. For the p-type siliconsemiconductor layers, silicon semiconductor layers containing impuritiesimparting p-type conductivity such as boron, aluminum or gallium, andhydrogen can be used.

Note that a silicon semiconductor layer having a lower carrierconcentration than the second silicon semiconductor layer 120 can beused for the first silicon semiconductor layer 110. In order to specifysuch a structure, in this specification, the conductivity type of ap-type semiconductor layer having a relatively low carrier concentrationsuch as the first silicon semiconductor layer 110 is referred to asp⁻-type, whereas the conductivity type of a p-type semiconductor layerhaving a relatively high carrier concentration such as the secondsilicon semiconductor layer 120 is referred to as p⁺-type.

The flow rate ratio of a dopant gas may be changed in film formation bya plasma CVD method or the like so that the carrier concentration of asemiconductor layer is adjusted. The carrier concentration can be highas the flow rate ratio of the dopant gas diborane or phosphine) is highto a source gas (e.g., monosilane). Further, by changing film formationpressure, temperature, power density, and the like, activation rate ofimpurities in the formed semiconductor layer is changed, so that carrierconcentration can be adjusted.

For the p⁻-type silicon semiconductor layer in one embodiment of thepresent invention, it is preferable to use an amorphous siliconsemiconductor layer in which the number of localized states due toimpurities is small. The electrical conductivity of the amorphoussilicon semiconductor layer in a dark condition is 1×10⁻¹⁰ S/cm to1×10⁻⁵ S/cm, preferably 1×10⁻⁹ S/cm to 1×10⁻⁶ S/cm, further preferably1×10⁻⁹ S/cm to 1×10⁻⁷ S/cm.

Note that the amorphous silicon semiconductor layer having theelectrical conductivity (dark conductivity) is an amorphous siliconsemiconductor layer which is controlled to be p⁻-type by intentionaladditions of impurities imparting p-type conductivity.

Further, the electrical conductivity of p⁺-type silicon semiconductorlayer in a dark condition is preferably greater than 1×10⁻⁵ S/cm.

In a photoelectric conversion device having a p-n junction, the increaseof a diffusion potential by the increase of the electric field in thep-n junction is one method to improve electric characteristics. Ingeneral, the diffusion potential can be increased by forming a junctionwith the use of a p⁺-type semiconductor or an n⁺-type semiconductorhaving a high carrier concentration; however, the highly dopedimpurities imparting conductivity types in the p⁺-type semiconductor andthe n⁺-type semiconductor increase the number of localized states.Further, interface states are formed because of the increased number oflocalized states, whereby carrier recombination in the vicinity of ajunction portion is induced. Thus, electric characteristics of thephotoelectric conversion device cannot be expected to be improved onlyby an increase of carrier concentration of a bonding layer.

On the other hand, in the photoelectric conversion device of oneembodiment of the present invention, a p⁻-type silicon semiconductorlayer and a p⁺-type silicon semiconductor layer are stacked on the onesurface of the crystalline silicon semiconductor substrate 100. Thep⁻-type silicon semiconductor layer, which is a semiconductor layercontaining hydrogen and few defects, serves as a bonding layer forforming a diffusion potential as well as a passivation layer forterminating defects on the surface of the crystalline silicon substrate.In addition, the p⁺-type silicon semiconductor layer serves to furtherincrease the diffusion potential. With the structure of such gradualbonding (n-p⁻-p⁺), carrier recombination affected by the interfacestates can be suppressed as much as possible while the diffusionpotential is increased.

In the photoelectric conversion device that is one embodiment, of thepresent invention, the opening is formed in the second siliconsemiconductor layer 120. Thus, light irradiation can be performed on thecrystalline silicon substrate that is a photoelectric conversion regionthrough the opening without passing through the second siliconsemiconductor layer 120. In the conventional heterojunctionphotoelectric conversion device, both a passivation layer for reducinginterface defects and a bonding layer for increasing the diffusionpotential have been stacked over the entire surface of a photoelectricconversion region; thus, light absorption loss has been apparent. On theother hand, in the photoelectric conversion device of one embodiment ofthe present invention, light absorption due to the second siliconsemiconductor layer 120 corresponding to the bonding layer does notoccur in the opening, so that the light absorption loss can be reducedas much as possible. Thus, with this advantageous effect, specifically,the short-circuit current of the photoelectric conversion device can beimproved.

The photoelectric conversion device of one embodiment of the presentinvention may have a structure as illustrated in a plan view of FIG. 2Aand a cross-sectional view of FIG. 2B taken along line B1-B2 of FIG. 2A.Although the photoelectric conversion device illustrated in FIGS. 2A and2B is different from the photoelectric conversion device in FIGS. 1A and1B in that the openings of the second silicon semiconductor layer 120 isreduced, the other structures are the same as those illustrated in FIGS.1A and 1B. Note that the shape of the opening and the opening area ofthe second silicon semiconductor layer 120 are not limited to thoseillustrated, and can be set freely.

The shape of the first electrode 170 illustrated in the plan view ofFIG. 2A is an example and is not limited thereto. For example, the widthof each of electrodes in the vertical direction and horizontaldirection, the number of electrodes, and an interval between electrodescan be determined as appropriate by a practitioner so that one of theelectrodes in the vertical direction or in the horizontal directionserve as bus bar electrodes and the other serve as finger electrodes.Further, as illustrated in FIG. 6, a region where the first electrode170 overlaps with the second silicon semiconductor layer 120 may be madesmall so that a light-receiving region is enlarged.

With such a structure, diffusion potential can be further increased, andan open circuit voltage and a fill factor can be improved. In thephotoelectric conversion device illustrated in FIGS. 2A and 2B, lightabsorption occurs in part of the second silicon semiconductor layer 120;thus, short-circuit current is smaller than that in the photoelectricconversion device illustrated in FIGS. 1A and 1B. Thus, practitioner canselect either structure as appropriate in accordance with the intendeduse.

Note that n-type silicon semiconductor layers can be used for the thirdsilicon semiconductor layer 130 and the fourth silicon semiconductorlayer 140 which are formed on the other surface of the crystallinesilicon substrate 100. For the n-type silicon semiconductor layers,silicon semiconductor layers including impurities imparting n-typeconductivity such as phosphorus, arsenic or antimony, and hydrogen canbe used.

Note that a silicon semiconductor layer having a lower carrierconcentration than the fourth silicon semiconductor layer 140 can beused for the third silicon semiconductor layer 130. In order to specifysuch a structure, in this specification, the conductivity type of an-type semiconductor layer having a relatively low carrier concentrationsuch as the third silicon semiconductor layer 130 is referred to asn⁻-type, whereas the conductivity type of a n-type semiconductor layerhaving a relatively high carrier concentration such as the fourthsilicon semiconductor layer 140 is referred to as n⁺-type.

For the n⁻-type silicon semiconductor layer in one embodiment of thepresent invention, it is preferable to use an amorphous siliconsemiconductor layer in which the number of localized states due toimpurities is small. The amorphous silicon semiconductor layer, which isa semiconductor layer containing hydrogen and few defects, serves as apassivation layer for terminating defects on the surface of thecrystalline silicon substrate 100. The electrical conductivity of theamorphous silicon semiconductor layer in a dark condition is 1×10⁻⁹ S/cmto 1×10⁻⁴ S/cm, preferably 1×10⁻⁸ S/cm to 1×10⁻⁵ S/cm, furtherpreferably 1×10⁻⁸ S/cm to 1×10⁻⁶ S/cm.

Note that the amorphous silicon semiconductor layer having theabove-described electrical conductivity (dark conductivity) is anamorphous silicon semiconductor layer which is controlled to be n⁻-typeby intentional additions of impurities imparting n-type conductivity.

Further, the electrical conductivity of the n⁺-type amorphous siliconsemiconductor layer in a dark condition in one embodiment of the presentinvention is preferably greater than 1×10⁻⁴ S/cm.

Further, an n-n⁺ junction is formed between the fourth siliconsemiconductor layer 140 that is an n⁺ type silicon semiconductor layerand the crystalline silicon substrate 100 with the third siliconsemiconductor layer 130 provided therebetween. In other words, thefourth silicon semiconductor layer 140 serves as a back surface field(BSF) layer. Minority carriers are repelled by the electric field formedby the junction and attracted to the p-n junction side, wherebyrecombination of carriers in the vicinity of the second electrode 190can be prevented.

Note that in the photoelectric conversion device of one embodiment ofthe present invention, the third silicon semiconductor layer 130 mayhave i-type conductivity. An i-type semiconductor layer in thisembodiment is a high-resistance semiconductor layer to which impuritiesimparting p-type conductivity or n-type conductivity are notintentionally added or a high-resistance semiconductor layer to whichimpurities imparting p-type conductivity or n-type conductivity areintentionally added to adjust the conductivity type; that is, asubstantially i-type semiconductor layer having lower electricalconductivity (dark conductivity) than the p⁻-type silicon semiconductorlayer and n⁻-type silicon semiconductor layer.

For the light-transmitting conductive film 150, the following can beused: indium tin oxide; indium tin oxide containing silicon; indiumoxide containing zinc; zinc oxide; zinc oxide containing gallium; zincoxide containing aluminum; tin oxide; tin oxide containing fluorine; tinoxide containing antimony; graphene, or the like. The light-transmittingconductive film 150 is not limited to a single layer, and a stackedstructure of different films may be employed.

The first electrode 170 and the second electrode 190 can be formed usinga low-resistance metal such as silver, aluminum, or copper by asputtering method, a vacuum evaporation method, or the like.Alternatively, the first electrode 170 and the second electrode 190 maybe formed using a conductive resin such as a silver paste or a copperpaste by a screen printing method or an inkjet method.

In the photoelectric conversion device of one embodiment of the presentinvention, as illustrated in FIGS. 3A and 3B, only one of the surfaces(the front surface and the back surface) may be processed to haveunevenness. In the photoelectric conversion device both surfaces ofwhich are processed to have unevenness, an optical effect such as anincrease in an optical path length can be obtained; at the same time,surface area of the crystalline silicon substrate is increased,resulting in an increase in the absolute amount of surface defects.Therefore, in consideration of the balance between the optical effectand the amount of the surface defects, a practitioner may determine thestructure so that more favorable electric characteristics can beobtained.

In the photoelectric conversion device of one embodiment of the presentinvention, as illustrated in FIGS. 4A and 4B, both surfaces of thecrystalline silicon substrate 100 may serve as light-receiving surfacesin such a manner that the fourth silicon semiconductor layer 140 havingan opening is formed on the third silicon semiconductor layer 130, alight transmitting conductive film 180 is formed on the fourth siliconsemiconductor layer 140, and the second electrode 190 having a gridshape is formed on the light-transmitting conductive film 180.

Next, a method for manufacturing the photoelectric conversion deviceillustrated in FIGS. 1A and 1B is described with reference to FIGS. 7Ato 7C and FIGS. 8A to 8C.

A single crystal silicon substrate or a polycrystalline siliconsubstrate, which has n-type conductivity, can be used for thecrystalline silicon substrate 100 which can be used in one embodiment ofthe present invention. There is no particular limitation on the methodfor manufacturing the crystalline silicon substrate. In this embodiment,a single crystal silicon substrate whose surface corresponds to the(100) plane and which is manufactured by a Magnetic Czochralski (MCZ)method is used for the crystalline silicon substrate 100.

Next, the front surface and the back surface of the crystalline siliconsubstrate 100 are subjected to a process for forming unevenness (seeFIG. 7A). Note that here, an example of a processing method for formingunevenness using the single crystal silicon substrate having (100) planeas a surface is described. In the case where a polycrystalline siliconsubstrate is used as the crystalline silicon substrate 100, unevennessmay be formed by a dry etching method or the like.

In the case where the initial single crystal silicon substrate is asubstrate which is subjected to only a slicing process, a damage layerwith a thickness of 10 μm to 20 μm, remaining on the surface of thesingle crystal silicon substrate, is removed by a wet etching process.For an etchant, an alkaline solution with a relatively highconcentration, for example, 10% to 50% sodium hydroxide solution, or 10%to 50% potassium hydroxide solution can be used. Alternatively, a mixedacid in which hydrofluoric acid and nitric acid are mixed, or the mixedacid to which acetic acid is further added may be used.

Next, impurities adhering to the surfaces of the single crystal siliconsubstrate from which the damage layers have been removed are removed byacid cleaning. As an acid, for example, a mixture (FPM) of 0.5%hydrofluoric acid and 1% hydrogen peroxide, or the like can be used.Alternatively, RCA cleaning or the like may be performed. Note that thisacid cleaning may be omitted.

The unevenness is formed utilizing a difference in etching rates amongplane orientations in etching of the crystalline silicon using thealkaline solution. For an etchant, an alkaline solution with arelatively low concentration, for example, 1% to 5% sodium hydroxidesolution, or 1% to 5% potassium hydroxide solution can be used,preferably several percent isopropyl alcohol is added thereto. Thetemperature of the etchant is 70° C. to 90° C., and the single crystalsilicon substrate is soaked in the etchant for 30 to 60 minutes. By thistreatment, unevenness including a plurality of minute projections eachhaving a substantially square pyramidal shape and recessions formedbetween adjacent projections can be formed on the surfaces of the singlecrystal silicon substrate.

Next, oxide layers which are non-uniformly formed on the silicon surfacein the etching step for forming the unevenness are removed. Anotherpurpose of removing the oxide layers is to remove a component of thealkaline solution, which is likely to remain in the oxide layers. Whenan alkali metal ion, e.g., a Na ion or a K ion enters silicon, thelifetime is decreased, and the electric characteristics of thephotoelectric conversion device are drastically lowered as a result.Note that in order to remove the oxide layer, 1 to 5 percent dilutedhydrofluoric acid may be used.

Next, the surfaces of the single crystal silicon substrate arepreferably etched with a mixed acid in which hydrofluoric acid andnitric acid are mixed, or the mixed acid to which acetic acid is furtheradded so that impurities such as a metal component are removed from thesurfaces. Addition of acetic acid allows the oxidizing ability of nitricacid to be maintained, the etching process to be stably performed, andthe etching rate to be readily controlled. For example, a volume ratioof hydrofluoric acid (approximately 50%), nitride acid (60% or more) andacetic acid (90% or more) can be 1:1.5 to 3:2 to 4. Note that in thisspecification, the mixed acid solution containing hydrofluoric acid,nitric acid, and acetic acid is referred to as HF-nitric-acetic acid.Further, in the etching with the HF-nitric-acetic acid, angles in crosssections of vertexes of the projections are made larger, so that asurface area can be reduced, and the absolute amount of surface defectscan be reduced. Note that in the case where the etching with theHF-nitric-acetic acid is performed, the above step of removing the oxidelayers with diluted hydrofluoric acid can be omitted. Through the stepsup to here, the surfaces of the single crystal silicon substrate that isthe crystalline silicon substrate 100 can have unevenness.

As illustrated in FIGS. 3A and 3B, in the case where a process forforming unevenness is performed on only one surface of the crystallinesilicon substrate 100, a resin film or the like having high alkaliresistance and high oxidation resistance may be provided on the onesurface of the crystalline silicon substrate 100 and then the resin filmmay be removed after the process for forming unevenness.

Next, after appropriate cleaning such as water cleaning, the thirdsilicon semiconductor layer 130 is formed on the back surface of thecrystalline silicon substrate 100 which is a side opposite to thelight-receiving surface by a plasma CVD method. The thickness of thethird silicon semiconductor layer 130 is preferably greater than orequal to 3 nm and less than or equal to 50 nm. In this embodiment, thethird silicon semiconductor layer 130 is n⁻-type amorphous silicon layerand has a thickness of 5 nm.

The third silicon semiconductor layer 130 may be formed, for example,under the following conditions: a source gas is introduced to a reactionchamber so that monosilane and hydrogen-based phosphine (0.5%) have aflow rate ratio of 1:0.3 to less than 1; the pressure inside thereaction chamber is higher than or equal to 100 Pa and lower than orequal to 200 Pa; the distance between electrodes is greater than orequal to 10 mm and less than or equal to 40 mm; the power density basedon the area of a cathode electrode is greater than or equal to 8 mW/cm²and less than or equal to 120 mW/cm²; and the substrate temperature ishigher than or equal to 150° C. and lower than or equal to 300° C.

Next, the fourth silicon semiconductor layer 140 is formed on the thirdsilicon semiconductor layer 130 (see FIG. 3B). The fourth siliconsemiconductor layer 140 preferably has a thickness of greater than orequal to 3 nm and less than or equal to 50 nm. In this embodiment, thefourth silicon semiconductor layer 140 is n⁺-type amorphous siliconlayer and has a thickness of 10 nm.

The fourth silicon semiconductor layer 140 may be formed, for example,under the following conditions: a source gas is introduced to a reactionchamber so that monosilane and hydrogen-based phosphine (0.5%) have aflow rate ratio of 1:1 to 15; the pressure inside the reaction chamberis higher than or equal to 100 Pa and lower than or equal to 200 Pa; thedistance between electrodes is greater than or equal to 10 mm and lessthan or equal to 40 mm; the power density based on the area of a cathodeelectrode is greater than or equal to 8 mW/cm² and less than or equal to120 mW/cm²; and the substrate temperature is higher than or equal to150° C. and lower than or equal to 300° C.

Next, the first silicon semiconductor layer 110 is formed on the surfaceof the crystalline silicon substrate 100 on the light-receiving surfaceside, by a plasma CVD method (see FIG. 7B). The thickness of the firstsilicon semiconductor layer 110 is preferably greater than or equal to 3nm and less than or equal to 50 nm. In this embodiment, the firstsilicon semiconductor layer 110 is a p⁻-type amorphous silicon layer andhas a thickness of 5 nm.

The first silicon semiconductor layer 110 can be formed, for example,under the following conditions: a source gas is introduced to a reactionchamber so that monosilane and hydrogen-based diborane (0.1%) have aflow rate ratio of 1:0.01 to less than 1; the pressure inside thereaction chamber is higher than or equal to 100 Pa and lower than orequal to 200 Pa; the distance between electrodes is greater than orequal to 10 mm and less than or equal to 40 mm; the power density basedon the area of a cathode electrode is greater than or equal to 8 mW/cm²and less than or equal to 120 mW/cm²; and the substrate temperature ishigher than or equal to 150° C. and lower than or equal to 300° C.

Next, a mask 200 having an opening is formed on the first siliconsemiconductor layer 110. The second silicon semiconductor layer 120 isformed by a lift-off method using the mask. The mask is preferablyformed using an inorganic material such as a photoresist or siliconoxide. In this embodiment, the mask 200 is formed in such a manner thata silicon oxide layer is formed by a film formation method such as asputtering method and then subjected to a known method such as aphotolithography method and or an etching method (see FIG. 7C).

Next, a silicon semiconductor film 120 a having p-type conductivity isformed on the mask 200 and the first silicon semiconductor layer 110(see FIG. 8A). The thickness of the silicon semiconductor film 120 a ispreferably greater than or equal to 3 nm and less than or equal to 50nm. In this embodiment, the silicon semiconductor film 120 a is p⁺-typeamorphous silicon film and has a thickness of 10 nm.

The silicon semiconductor film 120 a can be formed, for example, underthe following conditions: a source gas is introduced to a reactionchamber so that monosilane and hydrogen-based diborane (0.1%) have aflow rate ratio of 1:1 to 20; the pressure inside the reaction chamberis higher than or equal to 100 Pa and lower than or equal to 200 Pa; thedistance between electrodes is greater than or equal to 8 mm and lessthan or equal to 40 mm; the power density based on the area of a cathodeelectrode is greater than or equal to 8 mW/cm′ and less than or equal to50 mW/cm²; and the substrate temperature is higher than or equal to 150°C. and lower than or equal to 300° C.

Next, the mask 200 and an unnecessary portion of the siliconsemiconductor film 120 a are removed at the same time using bufferedhydrofluoric acid that is a mixed solution of hydrofluoric acid andammonium fluoride, so that the second silicon semiconductor layer 120 isformed (see FIG. 8B).

Note that in this embodiment, although an RF power source with afrequency of 13.56 MHz is used as a power source in forming the firstsilicon semiconductor layer 110, the second silicon semiconductor layer120, the third silicon semiconductor layer 130, and the fourth siliconsemiconductor layer 140, an RF power source with a frequency of 27.12MHz, 60 MHz, or 100 MHz may be used instead. In addition, the filmformation may be carried out by not only continuous discharge but alsopulse discharge. By the pulsed discharge, film quality can be improvedand generation of particles in a gas phase can be reduced.

Note that the formation order of the films provided on the front surfaceand the back surface of the crystalline silicon substrate 100 is notlimited to the order described above as long as the structureillustrated in FIG. 8B can be obtained. For example, the third siliconsemiconductor layer 130 is formed; then, the first silicon semiconductorlayer 110 may be formed.

Next, the light-transmitting conductive film 150 is formed on the secondsilicon semiconductor layer 120. The light-transmitting conductive film150 is formed using any of the above-described materials by a sputteringmethod. The thickness is preferably greater than or equal to 10 nm andless than or equal to 1000 nm.

Next, the second electrode 190 is formed on the fourth siliconsemiconductor layer 140. The second electrode 190 can be formed using alow-resistance metal such as silver, aluminum, or copper by a sputteringmethod, a vacuum evaporation method, or the like. Alternatively, thesecond electrode 190 may be formed using a conductive resin such as asilver paste or a copper paste by a screen printing method or an inkjetmethod.

Subsequently, the first electrode 170 is formed on thelight-transmitting conductive film 150 so as to overlap with the secondsilicon semiconductor layer 120 (see FIG. 8C). The first electrode 170is a grid electrode, which is preferably formed using a conductive resinsuch as a silver paste, a copper paste, a nickel paste, or a molybdenumpaste by a screen printing method or an inkjet method. Further, thefirst electrode 170 may be a stacked layer of different materials, suchas a stacked layer of a silver paste and a copper paste.

Note that in order to manufacture the photoelectric conversion deviceillustrated in FIGS. 2A and 2B, the first electrode 170 and the secondsilicon semiconductor layer 120 may be formed to have different shapesso that the first electrode 170 partly overlaps with the second siliconsemiconductor layer 120.

Further, in order to manufacture the photoelectric conversion deviceillustrated in FIGS. 4A and 4B, the third silicon semiconductor layer130 is formed, and then the fourth silicon semiconductor layer 140, thelight-transmitting conductive film 180, and the second electrode 190 areformed in accordance with the method for forming the second siliconsemiconductor layer 120, the light-transmitting conductive film 150, andthe first electrode 170 which are illustrated in FIG. 7C and FIGS. 8A to8C.

Accordingly, a photoelectric conversion device with low light absorptionloss and small resistance loss can be manufactured.

This embodiment can be freely combined with any of other embodiments.

Embodiment 2

In this embodiment, a photoelectric conversion device having a structuredifferent from that of the photoelectric conversion device described inEmbodiment 1 is described. Note that detailed description of portionswhich are similar to those of Embodiment 1 is omitted in thisembodiment.

FIG. 9 is a cross-sectional view of a photoelectric conversion deviceaccording to one embodiment of the present invention. The photoelectricconversion device includes a crystalline silicon substrate 300 havingsurfaces processed to have unevenness, a first silicon semiconductorlayer 310 formed on one surface of the crystalline silicon substrate300, a first light-transmitting conductive film 410 formed on the firstsilicon semiconductor layer 310 and having an opening, a second siliconsemiconductor layer 320 formed in the opening, a first electrode 370formed on the second silicon semiconductor layer 320, and a secondlight-transmitting conductive film 420 covering the stacked film formedon the one surface of the crystalline silicon substrate 300. Thephotoelectric conversion device also includes a third siliconsemiconductor layer 330 formed on the other surface of the crystallinesilicon substrate 300, a fourth silicon semiconductor layer 340 formedon the third silicon semiconductor layer 330, and a second electrode 390formed on the fourth silicon semiconductor layer 340. Note that thefirst electrode 370 is a grid electrode, and the surface on the firstelectrode 370 side serves as a light-receiving surface.

Alternatively, as illustrated in FIG. 10A, only one surface (the frontsurface or the back surface) of the crystalline silicon substrate 300may be processed to have unevenness. Note that in order to preventbroadening and disconnection of the first electrode 370, a part of thecrystalline silicon substrate 300 in contact with the first siliconsemiconductor layer 310 may be flat without being processed to haveunevenness.

Further alternatively, as illustrated in FIG. 10B, both surfaces of thecrystalline silicon substrate 300 may be light-receiving surfaces insuch a manner that a third light-transmitting conductive film 430 havingan opening is formed on the third silicon semiconductor layer 330, afourth silicon semiconductor layer 340 is formed in the opening, thesecond electrode 390 is formed on the fourth silicon semiconductor layer340, and a fourth light-transmitting conductive film 440 covering thestacked film formed on the other surface of the crystalline siliconsubstrate 300 is formed.

In the above structure, p-type silicon semiconductor layers can be usedfor the first silicon semiconductor layer 310 and the second siliconsemiconductor layer 320 which are formed over the one surface of thecrystalline silicon substrate 300. For the p-type silicon semiconductorlayers, silicon semiconductor layers containing impurities impartingp-type conductivity such as boron, aluminum or gallium, and hydrogen canbe used.

Note that a silicon semiconductor layer having a lower carrierconcentration than the second silicon semiconductor layer 320 can beused for the first silicon semiconductor layer 310. That is, a p⁻-typesilicon semiconductor layer can be used for the first siliconsemiconductor layer 310, and a p⁺-type silicon semiconductor layer canbe used for the second silicon semiconductor layer 320.

For the p⁻-type silicon semiconductor layer in one embodiment of thepresent invention, it is preferable to use an amorphous siliconsemiconductor layer in which the number of localized states due toimpurities is small. The electrical conductivity of the amorphoussilicon semiconductor layer in a dark condition is 1×10⁻¹° S/cm to1×10⁻⁵ S/cm, preferably 1×10⁻⁹ S/cm to 1×10⁻⁶ S/cm, further preferably1×10⁻⁹ S/cm to 1×10⁻⁷ S/cm.

Further, the electrical conductivity of the p⁺-type siliconsemiconductor layer in a dark condition is preferably greater than1×10⁻⁵ S/cm.

Note that n-type silicon semiconductor layers can be used for the thirdsilicon semiconductor layer 330 and the fourth silicon semiconductorlayer 340 which are formed on the other surface of the crystallinesilicon substrate 300. For the n-type silicon semiconductor layers,silicon semiconductor layers containing impurities imparting n-typeconductivity such as phosphorus, arsenic or antimony, and hydrogen canbe used.

Note that a silicon semiconductor layer having a lower carrierconcentration than the fourth silicon semiconductor layer 340 can beused for the third silicon semiconductor layer 330. That is, an n⁻-typesilicon semiconductor layer can be used for the third siliconsemiconductor layer 330, and a n⁺-type silicon semiconductor layer canbe used for the fourth silicon semiconductor layer 340.

For the n⁻-type silicon semiconductor layer in one embodiment of thepresent invention, it is preferable to use an amorphous siliconsemiconductor layer in which the number of localized states due toimpurities is small. The electrical conductivity of the amorphoussilicon semiconductor layer in a dark condition is 1×10⁻⁹ S/cm to 1×10⁻⁴S/cm, preferably 1×10⁻⁹ S/cm to 1×10⁻⁵ S/cm, further preferably 1×10⁻⁹S/cm to 1×10⁻⁶ S/cm.

Further, the electrical conductivity of the n⁺-type siliconsemiconductor layer is preferably greater than 1×10⁻⁴ S/cm in a darkcondition.

For the first to fourth light-transmitting conductive films 410, 420,430 and 440, the following can be used: indium tin oxide; indium tinoxide containing silicon; indium oxide containing zinc; zinc oxide; zincoxide containing gallium; zinc oxide containing aluminum; tin oxide; tinoxide containing fluorine; tin oxide containing antimony; graphene, orthe like. The light-transmitting conductive film is not limited to asingle layer, and a stacked structure of different films may beemployed.

The first electrode 370 and the second electrode 390 can be formed usinga low-resistance metal such as silver, aluminum, or copper by asputtering method, a vacuum evaporation method, or the like.Alternatively, the first electrode 370 and the second electrode 390 maybe formed using a conductive resin such as a silver paste or a copperpaste by a screen printing method or an inkjet method.

The photoelectric conversion device having the above-described structurein this embodiment as well as the photoelectric conversion devicedescribed in Embodiments 1 has a gentle junction (n-p⁻-p⁺ junction)structure, so that carrier recombination affected by the interface statecan be suppressed as much as possible while diffusion potential isincreased. Thus, an open circuit voltage and a fill factor can beparticularly improved.

In the photoelectric conversion device of this embodiment, the secondsilicon semiconductor layer 320 is formed in the opening of the firstlight-transmitting conductive film 410, whereby light absorption due tothe second silicon semiconductor layer 320 does not occur. Thus, lightabsorption loss can be reduced as much as possible.

Next, a method for manufacturing the photoelectric conversion deviceillustrated in FIG. 9 is described with reference to FIGS. 11A to 11Cand FIGS. 12A to 12C.

A single crystal silicon substrate or a polycrystalline siliconsubstrate, which has n-type conductivity, can be used for thecrystalline silicon substrate 300 which can be used in one embodiment ofthe present invention.

The front surface and the back surface of the crystalline siliconsubstrate 300 are subjected to a process for forming unevenness (seeFIG. 11A) in accordance with the method described in Embodiment 1 inFIG. 7A.

Next, the third silicon semiconductor layer 330 is formed on the backsurface of the crystalline silicon substrate 300 which is a sideopposite to the light-receiving surface by a plasma CVD method. Thethickness of the third silicon semiconductor layer 330 is preferablygreater than or equal to 3 nm and less than or equal to 50 nm. In thisembodiment, the third silicon semiconductor layer 330 is n⁻-typeamorphous silicon layer and has a thickness of 5 nm.

For the conditions for forming the third silicon semiconductor layer330, the conditions for forming the third silicon semiconductor layer130 described in Embodiment 1 can be referred to.

Next, the fourth silicon semiconductor layer 340 is formed on the thirdsilicon semiconductor layer 330. The fourth silicon semiconductor layer340 preferably has a thickness of greater than or equal to 3 nm and lessthan or equal to 50 nm. In this embodiment, the fourth siliconsemiconductor layer 340 is n⁺-type amorphous silicon layer and has athickness of 10 nm.

For the conditions for forming the fourth silicon semiconductor layer340, the conditions for forming the fourth silicon semiconductor layer140 described in Embodiment 1 can be referred to.

Next, the first silicon semiconductor layer 310 is formed on the surfaceof the crystalline silicon substrate 300 on the light-receiving surfaceside by a plasma CVD method (see FIG. 11B). The thickness of the firstsilicon semiconductor layer 310 is preferably greater than or equal to 3nm and less than or equal to 50 nm. In this embodiment, the firstsilicon semiconductor layer 310 is a p⁻-type amorphous silicon layer andhas a thickness of 5 nm.

For the conditions for forming the first silicon semiconductor layer310, the conditions for forming the first silicon semiconductor layer110 described in Embodiment 1 can be referred to.

Next, the first light-transmitting conductive film 410 having an openingis formed on the first silicon semiconductor layer 310 (see FIG. 11C).The opening of the light-transmitting conductive film 410 may be formedby using a known method such as photolithography method or an etchingmethod after the film formation; alternatively, by film formation usinga metal mask, by a lift-off method, or the like. Note that thelight-transmitting conductive film 410 is preferably formed by asputtering method.

Next, a silicon semiconductor film 320 a having p-type conductivity isformed on the first silicon semiconductor layer 310 and the firstlight-transmitting conductive film 410 (see FIG. 12A). The siliconsemiconductor film 320 a preferably has a thickness of greater than orequal to 3 nm and less than or equal to 50 nm. In this embodiment, thesilicon semiconductor film 320 a is a p⁺-type amorphous silicon film andhas a thickness of 10 nm.

For the conditions for forming the silicon semiconductor layer 320 a,the conditions for forming the silicon semiconductor film 120 adescribed in Embodiment 1 can be referred to.

Note that the formation order of the films provided on the surface sideand the back surface side of the crystalline silicon substrate 300 isnot limited to the order described above as long as the structureillustrated in FIG. 12A can be obtained. For example, the third siliconsemiconductor layer 330 is formed; then the first silicon semiconductorlayer 310 may be formed.

Next, the first electrode 370 is formed on the silicon semiconductorfilm 320 a. At this time, the first electrode 370 is preferably formedin accordance with the shape of the opening formed in the firstlight-transmitting conductive film 410. For the method for forming thefirst electrode 370, the method for forming the first electrode 170described in Embodiment 1 can be referred to.

An unnecessary portion of the silicon semiconductor film 320 a isremoved by a known method using the first electrode 370 as a mask, sothat the second silicon semiconductor layer 320 is formed (see FIG.12B).

Next, the second electrode 390 is formed on the fourth siliconsemiconductor layer 340. For the method for forming the second electrode390, the method for forming the second electrode 190 described inEmbodiment 1 can be referred to.

Next, the second light-transmitting conductive film 420 is formed so asto cover the stacked layer formed on the first light-transmittingconductive film 410 (see FIG. 12C). The second light-transmittingconductive film 420 is preferably formed by a sputtering method or thelike.

Accordingly, a photoelectric conversion device with low light absorptionloss and small resistance loss can be manufactured.

This embodiment can be freely combined with any of other embodiments.

Embodiment 3

In this embodiment, a photoelectric conversion device having a structuredifferent from those of the photoelectric conversion devices describedin Embodiments 1 and 2 is described. Note that that detailed descriptionof portions which are similar to those of Embodiment 1 and 2 is omittedin this embodiment.

FIG. 13 is a cross-sectional view of the photoelectric conversion deviceof one embodiment of the present invention. The photoelectric conversiondevice includes a crystalline silicon substrate 500 having surfacesprocessed to have unevenness, a first silicon semiconductor layer 510formed on one surface of the crystalline silicon substrate 500, a secondsilicon semiconductor layer 520 formed on the first siliconsemiconductor layer 510 and having an opening, a first electrode 570formed on the second silicon semiconductor layer 520, and alight-transmitting thin film 610 covering the stacked film formed on theone surface of the crystalline silicon substrate 500. The photoelectricconversion device also includes a third silicon semiconductor layer 530formed on the other surface of the crystalline silicon substrate 500, afourth silicon semiconductor layer 540 formed on the third siliconsemiconductor layer 530, and a second electrode 590 formed on the fourthsilicon semiconductor layer 540. Note that the first electrode 570 is agrid electrode, and the surface on the first electrode 570 side servesas a light-receiving surface.

Note that as illustrated in FIG. 14A, only one surface (the frontsurface or the back surface) of the crystalline silicon substrate 500may be processed to have unevenness. Note that in order to preventbroadening and disconnection of the first electrode 570, a part of thecrystalline silicon substrate 500 in contact with the first siliconsemiconductor layer 510 may be flat without being processed to haveunevenness.

Alternatively, as illustrated in FIG. 14B, both surfaces of thecrystalline silicon substrate 500 may be light-receiving surfaces insuch a manner that the fourth silicon semiconductor layer 540 having anopening is formed on the third silicon semiconductor layer 530, thesecond electrode 590 is formed on the fourth silicon semiconductor layer540, and a light-transmitting thin film 630 covering the stacked filmformed on the other surface of the crystalline silicon substrate 500 isformed.

In the above structure, p-type silicon semiconductor layers can be usedfor the first silicon semiconductor layer 510 and the second siliconsemiconductor layer 520 which are formed over the one surface of thecrystalline silicon substrate 500. For the p-type silicon semiconductorlayers, silicon semiconductor layers containing impurities impartingp-type conductivity such as boron, aluminum or gallium, and hydrogen canbe used.

Note that a silicon semiconductor layer having a lower carrierconcentration than the second silicon semiconductor layer 520 can beused for the first silicon semiconductor layer 510. That is, a p⁻-typesilicon semiconductor layer can be used for the first siliconsemiconductor layer 510, and a p⁺-type silicon semiconductor layer canbe used for the second silicon semiconductor layer 520.

For the p⁻-type silicon semiconductor layer in one embodiment of thepresent invention, it is preferable to use an amorphous siliconsemiconductor layer in which the number of localized states due toimpurities is small. The electrical conductivity of the amorphoussilicon semiconductor layer in a dark condition is 1×10⁻¹° S/cm to1×10⁻⁵ S/cm, preferably 1×10⁻⁹ S/cm to 1×10⁻⁶ S/cm, further preferably1×10⁻⁹ S/cm to 1×10⁻⁷ S/cm.

Further, the electrical conductivity of the p⁺-type siliconsemiconductor layer in a dark condition is preferably greater than1×10⁻⁵ S/cm.

Note that n-type silicon semiconductor layers can be used for the thirdsilicon semiconductor layer 530 and the fourth silicon semiconductorlayer 540 which are formed on the other surface of the crystallinesilicon substrate 500. For the n-type silicon semiconductor layers,silicon semiconductor layers containing impurities imparting n-typeconductivity such as phosphorus, arsenic or antimony, and hydrogen canbe used.

Note that a silicon semiconductor layer having a lower carrierconcentration than the fourth silicon semiconductor layer 540 can beused for the third silicon semiconductor layer 530. That is, a n⁻-typesilicon semiconductor layer can be used for the third siliconsemiconductor layer 530, and a n⁺-type silicon semiconductor layer canbe used for the fourth silicon semiconductor layer 540.

For the n⁻-type silicon semiconductor layer in one embodiment of thepresent invention, it is preferable to use an amorphous siliconsemiconductor layer where the number of localized states due toimpurities is small. The electrical conductivity of the amorphoussilicon semiconductor layer in a dark condition is 1×10⁻⁹ S/cm to 1×10⁻⁴S/cm, preferably 1×10⁻⁹ S/cm to 1×10⁻⁵ S/cm, further preferably 1×10⁻⁹S/cm to 1×10⁻⁶ S/cm.

Further, the electrical conductivity of the n⁺-type siliconsemiconductor layer is preferably greater than 1×10⁻⁴ S/cm in a darkcondition.

The light-transmitting thin film 610 can be formed of an insulating filmsuch as a silicon oxide film, a silicon nitride film, a silicon nitrideoxide (SiN_(x)O_(y) (x>y>0)) film, a silicon oxynitride (SiO_(x)N_(y)(x>y>0)) film, or an aluminum oxide film. The provision of thelight-transmitting thin film 610 enables less recombination of minoritycarriers in the vicinity of the surface of the first siliconsemiconductor layer 510. Further, the light-transmitting thin film 610also serves as an anti-reflection film. Note that the light-transmittingthin film 610 is removed in a portion where the first electrode 570 isconnected to a wiring or the like.

The first electrode 570 and the second electrode 590 can be formed usinga conductive resin such as a silver paste or a copper paste by a screenprinting method or an inkjet method. Alternatively, the first electrode570 and the second electrode 590 may be formed using a low-resistancemetal such as silver, aluminum, or copper by a sputtering method, avacuum evaporation method, or the like.

Here, the width of the first electrode 570 is preferably less than orequal to 100 μm, more preferably less than or equal to 50 μm. Further,the interval between the first electrodes 570 is less than or equal to500 μn, preferably less than or equal to 100 μm, more preferably lessthan or equal to 50 μm. The width of the first electrode 570 is madesmaller and the interval between the first electrodes 570 is madesmaller, whereby loss of photocarriers can be suppressed. That is,unlike the photoelectric conversion devices described in Embodiments 1and 2, the light-transmitting conductive film can be made unnecessary.The same can be said for the second electrode 590 in FIGS. 14A and 14B.

The photoelectric conversion device having the above-described structurein this embodiment as well as the photoelectric conversion devicedescribed in Embodiments 1 and 2 has a gentle junction (n-p⁻-p⁺junction) structure, so that carrier recombination affected by theinterface state can be suppressed as much as possible while diffusionpotential is increased. Accordingly, an open circuit voltage,particularly, a fill factor can be improved.

Furthermore, in the photoelectric conversion device of this embodiment,the second semiconductor layer 520 has an opening, whereby lightabsorption loss due to the second silicon semiconductor layer 520 doesnot occur in the opening. Thus, light absorption loss can be reduced asmuch as possible. Further, a light-transmitting conductive film is notformed, whereby influence of light-absorption loss can be eliminated.

Next, a method for manufacturing the photoelectric conversion deviceillustrated in FIG. 13 will be described with reference to FIGS. 15A to15C and FIGS. 16A to 16C.

A single crystal silicon substrate or a polycrystalline siliconsubstrate, which has n-type conductivity, can be used for thecrystalline silicon substrate 500 which can be used in one embodiment ofthe present invention.

The front surface and the back surface of the crystalline siliconsubstrate 300 are subjected to a process for forming unevenness inaccordance with the method described in Embodiment 1 in FIGS. 7A to 7C(see FIG. 15A).

Next, the third silicon semiconductor layer 530 is formed on the backsurface of the crystalline silicon substrate 500 which is a sideopposite to the light-receiving surface by a plasma CVD method. Thethickness of the third silicon semiconductor layer 530 is preferablygreater than or equal to 3 nm and less than or equal to 50 nm. In thisembodiment, the third silicon semiconductor layer 530 is n⁻-typeamorphous silicon layer and has a thickness of 5 nm.

For the conditions for forming the third silicon semiconductor layer530, the conditions for forming the third silicon semiconductor layer130 described in Embodiment 1 can be referred to.

Next, the fourth silicon semiconductor layer 540 is formed on the thirdsilicon semiconductor layer 530. The thickness of the fourth siliconsemiconductor layer 540 is preferably greater than or equal to 3 nm andless than or equal to 50 nm. In this embodiment, the fourth siliconsemiconductor layer 540 is n⁺-type amorphous silicon layer and has athickness of 10 nm.

For the conditions for forming the fourth silicon semiconductor layer540, the conditions for forming the fourth silicon semiconductor layer140 described in Embodiment 1 can be referred to.

Next, the first silicon semiconductor layer 510 is formed on the surfaceof the crystalline silicon substrate 500 on the light-receiving surfaceside, by a plasma CVD method (see FIG. 15B). The thickness of the firstsilicon semiconductor layer 510 is preferably greater than or equal to 3nm and less than or equal to 50 nm. In this embodiment, the firstsilicon semiconductor layer 510 is a p⁻-type amorphous silicon layer andhas a thickness of 5 nm.

For the conditions for forming the first silicon semiconductor layer510, the condition for forming the first silicon semiconductor layer 110described in Embodiment 1 can be referred to.

Next, a mask 600 having an opening is formed on the first siliconsemiconductor layer 510. The second silicon semiconductor layer 520 isformed by a lift-off method using the mask. The mask is preferablyformed of a photoresist or an inorganic material such as silicon oxide.In this embodiment, the mask 600 is formed in such a manner that asilicon oxide layer is formed by a film formation method such as asputtering method and then subjected to a photolithography method and anetching method (see FIG. 15C).

Next, a silicon semiconductor film 520 a having p-type conductivity isformed on the mask 600 and the first silicon semiconductor layer 510.The silicon semiconductor film 520 a preferably has a thickness ofgreater than or equal to 3 nm and less than or equal to 50 nm. In thisembodiment, the silicon semiconductor film 520 a is p⁺-type amorphoussilicon film and has a thickness of 10 nm.

Next, a conductive layer 570 a is formed in a portion that is in theopening of the mask 600 and is on the silicon semiconductor film 520 a(see FIG. 16A). The conductive layer can be formed using a conductiveresin such as a silver paste or a copper paste by a screen printingmethod or an inkjet method. Alternatively, the conductive layer may beformed using a low-resistance metal such as silver, aluminum, or copperby a sputtering method, a vacuum evaporation method, or the like.

Next, the mask 600 and an unnecessary portion of the siliconsemiconductor film 520 a are removed at the same time using bufferedhydrofluoric acid that is a mixed solution of hydrofluoric acid andammonium fluoride, so that the second silicon semiconductor layer 520 isformed (see FIG. 16B).

Next, the light-transmitting thin film 610 is formed so as to cover thefirst silicon semiconductor layer 510, the second silicon semiconductorlayer 520, and the first electrode 570. A silicon oxide film or asilicon nitride film with a thickness of greater than or equal to 50 nmand less than or equal to 100 nm, which is formed by a plasma CVD methodor a sputtering method, can be used as the light-transmitting thin film.In this embodiment, a 50-nm-thick silicon nitride film is used as thelight-transmitting thin film 610.

Next, the second electrode 590 is formed on the fourth siliconsemiconductor layer 540 (see FIG. 16C). For the method for forming thesecond electrode 590, the method for forming the second electrode 190described in Embodiment 1 can be referred to.

Accordingly, a photoelectric conversion device with low light absorptionloss and small resistance loss, which is one embodiment of the presentinvention can be manufactured.

This embodiment can be freely combined with any of other embodiments.

This application is based on Japanese Patent Application serial no.2011-221164 filed with Japan Patent Office on Oct. 5, 2011 and JapanesePatent Application serial no. 2012-107481 filed with the Japan PatentOffice on May 9, 2012, the entire contents of which are herebyincorporated by reference.

What is claimed is:
 1. A photoelectric conversion device comprising: acrystalline silicon substrate; a first silicon semiconductor layer onone surface of the crystalline silicon substrate, the first siliconsemiconductor layer having a p-type conductivity; a second siliconsemiconductor layer which is partially over the first siliconsemiconductor layer, the second silicon semiconductor layer having ap-type conductivity; a first light-transmitting conductive film over thesecond silicon semiconductor layer; and a first electrode over the firstlight-transmitting conductive film, wherein the first electrodepartially overlaps with the second silicon semiconductor layer.
 2. Thephotoelectric conversion device according to claim 1, furthercomprising: a third silicon semiconductor layer under the crystallinesilicon substrate, the third silicon semiconductor layer having ann-type conductivity or an i-type conductivity; a fourth siliconsemiconductor layer under the third silicon semiconductor layer, thefourth silicon semiconductor layer having an n-type conductivity; and asecond electrode under the fourth silicon semiconductor layer.
 3. Thephotoelectric conversion device according to claim 1, furthercomprising: a third silicon semiconductor layer under the crystallinesilicon substrate, the third silicon semiconductor layer having ann-type conductivity or an i-type conductivity; a fourth siliconsemiconductor layer under the third silicon semiconductor layer, thefourth silicon semiconductor layer partially overlapping with the thirdsilicon semiconductor layer and having an n-type conductivity; a secondlight-transmitting conductive film under the fourth siliconsemiconductor layer; and a second electrode under the secondlight-transmitting conductive film, wherein the second electrodepartially overlaps with the fourth silicon semiconductor layer, andwherein the third silicon semiconductor layer includes a portion notoverlapped with the fourth silicon semiconductor layer nor the secondelectrode.
 4. The photoelectric conversion device according to claim 1,wherein at least one of the one surface and a surface which is oppositeto the one surface has a plurality of projections.
 5. The photoelectricconversion device according to claim 1, wherein the second siliconsemiconductor layer has a higher carrier concentration than the firstsilicon semiconductor layer.
 6. The photoelectric conversion deviceaccording to claim 3, wherein the fourth silicon semiconductor layer hasa higher carrier concentration than the third silicon semiconductorlayer.
 7. A photoelectric conversion device comprising: a crystallinesilicon substrate; a first silicon semiconductor layer on one surface ofthe crystalline silicon substrate, the first silicon semiconductor layerhaving a p-type conductivity; a second silicon semiconductor layer whichis partially over the first silicon semiconductor layer, the secondsilicon semiconductor layer having a p-type conductivity; a firstlight-transmitting conductive film over the second silicon semiconductorlayer; and a first electrode over the first light-transmittingconductive film, wherein the first electrode partially overlaps with thesecond silicon semiconductor layer, and wherein the first siliconsemiconductor layer includes a portion not overlapped with the secondsilicon semiconductor layer nor the first electrode.
 8. Thephotoelectric conversion device according to claim 7, furthercomprising: a third silicon semiconductor layer under the crystallinesilicon substrate, the third silicon semiconductor layer having ann-type conductivity or an i-type conductivity; a fourth siliconsemiconductor layer under the third silicon semiconductor layer, thefourth silicon semiconductor layer having an n-type conductivity; and asecond electrode under the fourth silicon semiconductor layer.
 9. Thephotoelectric conversion device according to claim 7, furthercomprising: a third silicon semiconductor layer under the crystallinesilicon substrate, the third silicon semiconductor layer having ann-type conductivity or an i-type conductivity; a fourth siliconsemiconductor layer under the third silicon semiconductor layer, thefourth silicon semiconductor layer partially overlapping with the thirdsilicon semiconductor layer and having an n-type conductivity; a secondlight-transmitting conductive film under the fourth siliconsemiconductor layer; and a second electrode under the secondlight-transmitting conductive film, wherein the second electrodepartially overlaps with the fourth silicon semiconductor layer, andwherein the third silicon semiconductor layer includes a portion notoverlapped with the fourth silicon semiconductor layer nor the secondelectrode.
 10. The photoelectric conversion device according to claim 7,wherein at least one of the one surface and a surface which is oppositeto the one surface has a plurality of projections.
 11. The photoelectricconversion device according to claim 7, wherein the second siliconsemiconductor layer has a higher carrier concentration than the firstsilicon semiconductor layer.
 12. The photoelectric conversion deviceaccording to claim 9, wherein the fourth silicon semiconductor layer hasa higher carrier concentration than the third silicon semiconductorlayer.